UMC Reports Third Quarter 2015 Results

3Q15 wafer shipments decreased 4.5% to 1,467K. Quarterly capacity increased to 1,685K, resulting in an overall utilization rate of 89%.

Capacity[4] for Foundry Segment

Total capacity in the third quarter increased 1.5% to 1,685K 8-inch equivalent wafers. Continuous expansion of 28nm capacity at Fab 12A grew quarterly capacity to 206K in 3Q15 from 198K in 2Q15. The deployment of 8" capacity at Fab8N increased to 178K in 3Q15 up from 162K in 2Q15. Projected total capacity for the fourth quarter will grow to 1,690K 8-inch equivalent wafers due to continuous expansion at Fab 8N.

Annual Capacity in

thousands of wafers


Quarterly Capacity in

thousands of wafers

FAB

Geometry
(um)

2015E

2014

2013

2012


FAB

4Q15E

3Q15

2Q15

1Q15

WTK*

6"

3.5 - 0.45

311

-

-

-


WTK*

99

99

113

-

Fab 6A

6"

3.5 - 0.45

111

448

448

481


Fab 6A

-

-

-

111

Fab 8A

8"

0.5 - 0.25

813

813

813

815


Fab 8A

204

204

204

201

Fab 8C

8"

0.35 - 0.11

347

347

347

360


Fab 8C

87

87

87

86

Fab 8D

8"

0.13 - 0.09

341

358

382

371


Fab 8D

86

86

86

84

Fab 8E

8"

0.5 - 0.18

418

418

418

449


Fab 8E

105

105

105

103

Fab 8F

8"

0.18 - 0.11

388

388

388

389


Fab 8F

98

98

98

96

Fab 8S

8"

0.18 - 0.11

335

335

335

348


Fab 8S

84

84

84

83

Fab 8N

8"

0.5 - 0.13

667

547

469

-


Fab 8N

183

178

162

144

Fab 12A

12"

0.18 - 0.028

793

700

651

579


Fab 12A

206

206

198

183

Fab 12i

12"

0.13 - 0.040

572

573

550

537


Fab 12i

144

144

144

139

Total (1)  

6,617

6,323

6,107

5,514


Total

1,690

1,685

1,659

1,583

YoY Growth Rate

5%

4%

11%

4%





2012 figures account for UMC parent company only.

(1) One 6-inch wafer is converted into 0.5625(6 2 /8 2 ) 8-inch equivalent wafer; one 12-inch wafer is converted into 2.25(12 2 /8 2 ) 8-inch equivalent wafers. Capacity total figures are expressed in 8-inch equivalent wafers. *UMC sold part of plants and equipment to WTK; WTK figures represent 6-inch CMOS capacity.


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