The company adopted a full-suite license and has targeted a next generation global semiconductor product family based on heterogeneous advanced technology system-in-package (SIP.) Details of the design remain scant due to the propriety nature of the underlying technology.
The licensing agreement marks a major milestone for MZ Technologies, representing its initial entry into the broad Asian market.
"To be the co-design tool of choice in the international marketplace is a huge step forward," said Anna Fontanelli, Founder and CEO of MZ Technologies. "It is global confirmation of the tool's contribution to the future of chiplet-based and advanced hybrid package design.
GENIO™ 1.7 is the first commercial integrated silicon/packaging co-design tool, available to IC and IC Package design leading companies. Its cross-hierarchical, 3D-aware, design methodologies streamline the entire IC eco-system. It integrates IC and advanced packaging design to ensure full system level optimization, shorten the design cycle, drive faster time-to-manufacturing and improve yields.
GENIO™ 1.7 co-plans the final packaged device and integrated electronic circuits (ICs) in complex 2.5-3D chiplet-based hybrid configurations and was recognized by an international jury of industry experts as a revolutionary EDA co-design tool.
The GENIO tool also easily integrates existing silicon and package EDA flows to create full co-design and optimization of complex multi-chip designs that comprise advanced heterogeneous microelectronic systems.
GENIO™ 1.7 licensed under this agreement features Parasitic Estimation and Stack Planning functionality that slash total design time and reduces overall design complexity.
Parasitic Estimation enables early-on system analysis, based on virtual routes, prior to physical implementation. Stack Planning Support automatically identifies the best 3D stack configuration, given physical and electrical constraints. It provides a more efficient chiplet-based 3D-IC system organization and electrical performance, while reducing the physical resources (TSVs) required for vertical interconnect.
For a more information, go to www.monozukuri.eu
About MZ Technologies
MZ Technologies is the marketing function of Monozukuri S.p.A. Monozukuri's mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.
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SOURCE Monozukuri Technologies
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