HiSilicon Expands Cadence Palladium XP Platform Usage For Mobile and Digital Media SoC and ASIC Development

SAN JOSE, Calif., May 12, 2014 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that HiSilicon further expanded usage of the Cadence® Palladium® XP Verification Computing Platform as its emulation solution for mobile and digital media System-on-Chip (SoC) and ASIC development.

Cadence Logo

HiSilicon provides ASICs and SoCs for communication network and digital media, including solutions for network surveillance, videophones, Digital Video Broadcast and IPTV.  Solutions for these markets require a high level of quality, with robust hardware-software verification, and a quick turn-around time to meet aggressive time-to-market needs.

"We expanded our usage of the Palladium XP platform due to its performance, flexibility, hardware and software co-development efficiency and ability to shorten the time to market for our designs," said Yanqiu Diao, deputy GM, Turing Processor Business Unit at HiSilicon. "The power verification and analysis capabilities of Palladium XP are also a good match for our increasing number of low power mobile designs."

Part of the Cadence System Development Suite, the Palladium XP platform is the industry's first high-performance, special-purpose verification computing platform that unifies best-in-class simulation acceleration and emulation capabilities in a single environment. For more information on the Palladium XP platform, visit www.cadence.com/news/pxp.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Palladium and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries.  All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

Logo - http://photos.prnewswire.com/prnh/20140102/SF39436LOGO

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
HiSilicon
Web: http://www.cadence.com

Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise