QuickLogic Inks eFPGA Sales Rep Agreement with CHIP-gogo in Japan

SAN JOSE, Calif., Nov. 11, 2022 — (PRNewswire) — QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, today announced that it has signed an embedded FPGA (eFPGA) IP sales rep agreement with CHIP-gogo, based in Osaka, Japan. The new relationship has been put in place to match CHIP-gogo's broad semiconductor intellectual property (IP) and LSI design experience and deep customer relationships throughout Japan with the extensive post-manufacturing re-programmability benefits offered by QuickLogic's eFPGA technology.

"Customers who are developing advanced SoC devices can implement flexible software running on embedded processors but are often limited by fixed hardware functionality," said Takeshi Haruki, founder of CHIP-gogo. "Now, we can help them support emerging standards, address evolving competitive threats, or pursue adjacent market opportunities for a variety of use cases without needing to go through the costly and lengthy silicon re-design cycle. By adding hardware-based flexibility, SoC designers can extend product lifecycles and dramatically increase profitability."

"The founders of CHIP-gogo have extensive experience and contacts in the SoC space in Japan, and we look forward to successfully delivering and supporting eFPGA technology for our mutual customers there," said Owen Bateman, VP of worldwide sales at QuickLogic Corporation.

QuickLogic's eFPGA IP technology is available now, enabling CHIP-gogo to assist their customers in quickly and easily integrating the IP into their own SoC designs targeting nearly any foundry and process node. For more information, visit https://www.quicklogic.com/products/efpga/efpga-ip-software.

About CHIP-gogo

The CHIP-gogo team is made up of industry veterans with decades of experience in semiconductor sales, EDA tools, and SoC/ASIC design. The company's founders have extensive customer relationships and are focused on providing the world's best technology to SoC design teams in Japan. For more information, please visit https://www.chip-gogo.com

About QuickLogic 

QuickLogic Corporation (NASDAQ: QUIK) is a fabless semiconductor company that develops low power, multi-core semiconductor platforms, and Intellectual Property (IP) for Artificial Intelligence (AI), voice and sensor processing. The solutions include embedded FPGA IP (eFPGA) for hardware acceleration and pre-processing, and heterogeneous multi-core SoCs that integrate eFPGA with other processors and peripherals. The Analytics Toolkit from our recently acquired wholly owned subsidiary, SensiML Corporation, completes the end-to-end solution with accurate sensor algorithms using AI technology. The full range of platforms, software tools and eFPGA IP enables the practical and efficient adoption of AI, voice, and sensor processing across mobile, wearable, hearable, consumer, industrial, edge and endpoint IoT. For more information, visit www.quicklogic.com and https://www.quicklogic.com/blog.

The QuickLogic logo and QuickLogic are registered trademarks of QuickLogic Corporation. All other brands or trademarks are the property of their respective holders and should be treated as such.

 

Cision View original content to download multimedia: https://www.prnewswire.com/news-releases/quicklogic-inks-efpga-sales-rep-agreement-with-chip-gogo-in-japan-301675364.html

SOURCE QuickLogic Corporation

Contact:
Company Name: QuickLogic Corporation
Andrea Vedanayagam, Veda Communications, 408.656.4494
Email Contact
Financial data for QuickLogic Corporation

Featured Video
Jobs
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise