“Today’s consumer electronics require high bandwidth and low-cost manufacturability,” said Martin Scott, senior vice president of Research and Technology Development at Rambus. “Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging.”
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on www.rambus.com.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' innovations and solutions enable unprecedented performance in computing, communications, and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as a range of leadership and industry-standard memory solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
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Rambus Public Relations
Linda Ashmore, 650-947-5411
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