The percentage of revenue from fabless customers increased to 74% in 3Q08 mainly due to the increased demand from North America fabless companies.
Revenue Breakdown by Customer Type
Customer Type 3Q08 2Q08 1Q08 4Q07 3Q07
Fabless 74% 71% 70% 76% 73%
IDM 26% 29% 30% 24% 27%
System 0% 0% 0% 0% 0%
Revenue from the communication segment increased to 59% of total revenue in 3Q08 due to the higher revenue for both wireless and wired applications.
Revenue Breakdown by Application (1)
Application 3Q08 2Q08 1Q08 4Q07 3Q07
Computer 16% 17% 21% 19% 18%
Communication 59% 58% 56% 56% 57%
Consumer 23% 22% 21% 23% 23%
Memory 1% 1% 1% 1% 1%
Others 1% 2% 1% 1% 1%
(1) Computer consists of ICs such as HDD controllers, DVD-ROM/CD-ROM
drives ICs, LCD drivers, graphic processors, and PDAs. Communication
consists of xDSL, DSP, WLAN, LAN controllers, handset components,
caller ID devices, etc. Consumer consists of ICs used for DVD players,
game consoles, digital cameras, smart cards, toys, etc. Memory
consists of DRAM, SRAM, Flash, EPROM, ROM, and EEPROM.
Note 3: Revenue in this section represents wafer sales
Blended Average Selling Price Trend
The blended average selling price (ASP) decreased by 1% during 3Q08, due to product mix changes.
(To view ASP trend, visit http://www.umc.com/english/investors/3Q08_ASP_trend.asp )
Shipment and Utilization Rate (Note 4)
883 thousand 8-inch equivalent wafers were shipped in 3Q08, a 1% increase from 875 thousand 8-inch equivalents shipped in the previous quarter. Overall utilization rate for the quarter was 79%.
Wafer Shipments
3Q08 2Q08 1Q08 4Q07 3Q07
Wafer Shipments
('000 8-inch eq.) 883 875 807 921 1,017
Quarterly Capacity Utilization Rate
3Q08 2Q08 1Q08 4Q07 3Q07
Utilization Rate 79% 85% 73% 86% 93%
Total Capacity
('000 8-inch eq.) 1,149 1,107 1,100 1,100 1,095
Note 4: Utilization Rate = Quarterly Wafer Out / Quarterly Capacity
Capacity (Note 5)
Total capacity during the third quarter was 1,149 thousand 8-inch equivalent wafers. Compared to 2Q08, the increase of 42 thousand 8-inch equivalent wafers was due to capacity expansion at Fab 12A, Fab 12i and some 200mm fabs. Estimated installed capacity in the fourth quarter is 1,151 thousand 8-inch equivalent wafers. 2008 full-year capacity is estimated to be 5% up from that of 2007.
Annual Capacity in thousands of 8-inch wafer equivalents
FAB Geometry 2008E 2007 2006 2005
(um)
Fab 6A 6" 3.5 - 0.45 328 328 328 344
Fab 8AB 8" 0.5 - 0.25 816 816 816 816
Fab 8C 8" 0.35 - 0.15 411 400 400 401
Fab 8D 8" 0.18 - 0.09 263 260 252 274
Fab 8E 8" 0.5 - 0.18 408 408 406 404
Fab 8F 8" 0.25 - 0.15 372 372 372 378
Fab 8S (1) 8" 0.25 - 0.15 291 276 276 278
Fab 12A 12" 0.18 - 0.065 876 847 754 597
Fab 12i (2) 12" 0.13 - 0.065 742 601 413 363
Total (3) 4,507 4,308 4,017 3,855
YoY Growth Rate 5% 7% 4% 22%
Quarterly Capacity in thousands of 8-inch wafer equivalents
FAB 4Q08E 3Q08 2Q08 1Q08
Fab 6A 82 82 82 82
Fab 8AB 204 204 204 204
Fab 8C 111 108 101 100
Fab 8D 60 63 66 65
Fab 8E 102 102 102 102
Fab 8F 93 93 93 93
Fab 8S 75 75 72 69
Fab 12A 222 220 218 216
Fab 12i 202 202 169 169
Total (3) 1,151 1,149 1,107 1,100
(1) Former fab of SiSMC, which was acquired from Silicon Integrated
Systems in July 2004.
(2) Former fab of UMCi, a UMC wholly owned subsidiary in December 2004
that was merged into UMC in April 2005
(3) One 6-inch wafer is converted into 0.5625(6sq/8sq) 8-inch equivalent
wafer; one 12-inch wafer is converted into 2.25 (12sq/8sq) 8-inch
equivalent wafers.
