-- In non-volatile memory, ST introduced 1MHz two-wire serial EEPROMs in
256-Kbit, 512-Kbit and 1-Mbit densities, allowing data rates up to
2.5-times faster than the I2C Fast-mode.
-- In MEMS motion sensors, ST gained design wins for its three-axis
accelerometers with several mobile phone makers in China and a major
Asian player. The Company also gained significant business from a
worldwide leader in the portable MP3 player market and also won a
significant contract with another of the major players in the gaming
market -- ST already supplies MEMS accelerometers for the Nintendo Wii.
Additionally, ST's complete free-fall detection solution, which consists
of a 3-axis motion sensor and software, was chosen to protect user data
stored on HDDs in the new ESPRIMO Mobile family of professional
notebooks from Fujitsu Siemens Computers.
-- Also in MEMS, ST launched an ultra-compact gyroscope that provides a
choice of analog or digital absolute angular-rate outputs, and measures
fast angular displacements in applications such as intuitive man-machine
interfaces or enhanced-GPS for car navigation.
-- In power conversion, ST introduced a new Pulse Width Modulation
controller, the first integrated device optimized for soft-switching
asymmetrical half-bridge converters. The company also gained a design
win from a major player in the PC market for two voltage-regulator
modules for the CPU power supply in a desktop reference design; in
addition to another design win for a new powerline communication
transceiver with a manufacturer in China for a sub-metering application.
ST is also ramping up production of: a new power management controller,
for a major Taiwanese motherboard OEM; and a DC/DC switching regulator,
for a major Japanese brand digital-still-camera.
-- Also in power conversion, ST introduced into the market a new 10-12A
overvoltage-protected AC switch series, aimed at helping white goods
meet the latest energy and safety standards. ST also enlarged its
high-junction-temperature TRIAC family with a new sensitive series
dedicated to small appliances and industrial systems.
-- In power MOSFETs, ST introduced a 250A power MOSFET with the lowest
on-resistance in the market and a new family of devices based on the
company's innovative SuperMESH3 technology to increase the ruggedness,
switching performance and efficiency of lighting ballasts and
switch-mode power-supply applications. ST gained multiple design wins
for its MOSFETs, primarily in lighting and power-supply applications,
including one with a leading PC motherboard maker. In power bipolar
devices, ST's low-voltage bipolars were qualified for use by a major
smart-metering-system customer. And in linear and interface devices, ST
gained design wins in various markets, including automotive and audio
applications.
-- In advanced analog and logic ICs, ST announced a highly integrated RGB
LED driver and gained design wins for its logic ICs with major notebook
PC makers in China and Japan, and with a leading Japanese LCD TV maker.
-- In analog and mixed-signal ICs, ST announced a new series of
clock-distribution ICs and also sampled clock-distribution ICs to two
major Asian mobile-phone customers. Additionally, reset and temperature
sensors were designed-in at a major HDD maker and a real-time clock IC
was designed-in at a major GPS manufacturer.
Technology Highlights
-- ST, Infineon Technologies and STATS ChipPAC announced an agreement to
jointly develop the next-generation of embedded Wafer-Level Ball Grid
Array (eWLB) technology for use in manufacturing future-generation
semiconductor packages.
-- ST and the Waseda University Humanoid Robotics Institute (HRI) announced
the development of a high-performance, two-wheel inverted-pendulum
robot, called WV-1, which is the first result of an ongoing cooperation
for the research and development of technology and solutions for
innovative humanoid robots and medical-care robot systems.
All of STMicroelectronics' press releases (including all releases in Q3) are available at www.st.com/stonline/press/news/latest.htm.
SuperMESH and SoundTerminal are trademarks of STMicroelectronics. All other trademarks or registered trademarks are the property of their respective owners.
Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management's current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements due to, among other factors:
-- further deterioration on the worldwide financial markets, economic
recession in one or more of the world's major economies and the effect
on demand for semiconductor products in the key application markets and
from key customers served by our products , which in turn makes it
extremely difficult to accurately forecast and plan future business
activities;
-- our ability to adequately utilize and operate our manufacturing
facilities at sufficient levels to cover fixed operating costs
particularly at a time of decreasing demand for our products due to
decline in demand for semiconductor products;
-- pricing pressures which are highly variable and difficult to predict;
-- the results of actions by our competitors, including new product
offerings and our ability to react thereto;
-- the financial impact of obsolete or excess inventories if actual demand
differs from our anticipations;
-- the impact of intellectual-property claims by our competitors or other
third parties, and our ability to obtain required licenses on reasonable
terms and conditions;
-- the outcome of ongoing litigation as well as any new litigation to which
we may become a defendant;
-- our ability to close as planned the merger of ST-NXP Wireless with
Ericsson Mobile Platforms as announced on August 20, 2008;
-- the effects of hedging, which we practice in order to minimize the
impact of variations between the U.S. dollar and the currencies of the
other major countries in which we have our operating infrastructure in
the currently very volatile currency environments;
-- our ability to manage in an intensely competitive and cyclical industry,
where a high percentage of our costs are fixed, incurred in currencies
other than US dollars;
-- our ability to restructure in accordance with our plans if unforeseen
events require adjustments or delays in implementation;
-- our ability in an intensively competitive environment to secure customer
acceptance and to achieve our pricing expectations for high-volume
supplies of new products in whose development we have been, or are
currently, investing;
-- the ability of our suppliers to meet our demands for supplies and
materials and to offer competitive pricing;
-- significant differences in the gross margins we achieve compared to
expectations, based on changes in revenue levels, product mix and
pricing, capacity utilization, variations in inventory valuation, excess
or obsolete inventory, manufacturing yields, changes in unit costs,
impairments of long-lived assets (including manufacturing, assembly/test
and intangible assets), and the timing, execution and associated costs
for the announced transfer of manufacturing from facilities designated
for closure and associated costs, including start-up costs;
-- changes in the economic, social or political environment, including
military conflict and/or terrorist activities, as well as natural events
such as severe weather, health risks, epidemics or earthquakes in the
countries in which we, our key customers and our suppliers, operate; and
-- changes in our overall tax position as a result of changes in tax laws
or the outcome of tax audits, and our ability to accurately estimate tax
credits, benefits, deductions and provisions and to realize deferred tax
assets.
