Amir Panush, CEO of CEVA, commented: "Iri is a results-driven semiconductor and technology executive with deep expertise in corporate strategy, marketing and business development. His experience and knowledge gained from more than 20 years in the semiconductor industry will be instrumental in defining the company's future strategy and help drive long-term growth."
Mr. Trashanski said, "I am excited to join CEVA alongside Amir and the executive team. CEVA has built an impressive position as the trusted partner to semiconductors and OEMs for wireless connectivity, sensing and inferencing silicon IP and software. I look forward to helping the company expand on this success and uncover untapped markets and growth opportunities that will build shareholder value."
Iri Trashanski most recently served as the VP and GM of Data Center at GlobalFoundries, where he achieved an impressive growth in annual revenues and profitability and secured multi-billion-dollar long-term business contracts. He also led the company's strategy process and corporate development team. Before his tenure at GlobalFoundries, Mr. Trashanski held the position of Senior Vice President of Product and Market Development at Hitachi Vantara, where he steered strategic product direction, execution, and pivotal partnerships. His leadership journey includes significant executive positions at respected companies such as Samsung Semiconductors, Marvell, and SanDisk. He holds a Master of Business Administration degree from Babson College and a Bachelor of Arts degree from IDC, Israel.
About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary embedded software for sensor fusion, image enhancement, computer vision, spatial audio, voice input and artificial intelligence. Leveraging our technologies, many of the world's leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT.
Our DSP and AI based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For motion sensing solutions, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit ("IMU") solutions for markets including hearables, wearables, AR/VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth connectivity (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband ( UWB), NB-IoT and GNSS are the most broadly licensed connectivity platforms in the industry.
CEVA is a sustainable and environmentally conscious company, adhering to our Code of Business Conduct and Ethics. As such, we emphasize and focus on environmental preservation, recycling, the welfare of our employees and privacy – which we promote on a corporate level. At CEVA, we are committed to social responsibility, values of preservation and consciousness towards these purposes.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook,, LinkedIn and Instagram.
Forward Looking Statements
This press release contains forward-looking statements that involve risks and uncertainties, as well as assumptions that if they materialize or prove incorrect, could cause the results of CEVA to differ materially from those expressed or implied by such forward-looking statements and assumptions. Forward-looking statements include statements regarding Mr. Trashanski's role in defining CEVA's future strategy and CEVA's prospects for long-term growth, expanding on prior successes and uncovering untapped markets and growth opportunities. The risks, uncertainties and assumptions that could cause differing CEVA results include: the effect of intense industry competition; the ability of CEVA's technologies and products incorporating CEVA's technologies to achieve market acceptance; CEVA's ability to meet changing needs of end-users and evolving market demands; the cyclical nature of and general economic conditions in the semiconductor industry; CEVA's ability to diversify its royalty streams and license revenues; CEVA's ability to continue to generate significant revenues from the handset baseband market and to penetrate new markets; and general market conditions and other risks relating to CEVA's business, including, but not limited to, those that are described from time to time in our SEC filings. CEVA assumes no obligation to update any forward-looking statements or information, which speak as of their respective dates.
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SOURCE CEVA, Inc.
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For More Information Contact: Yaniv Arieli, CEVA, Inc., CEO Phone: +1.650.417.7941, yaniv.arieli@ceva-dsp.com; Richard Kingston, CEVA, Inc., VP Market Intelligence, Investor & Public Relations Phone: +1.650.417.7976, richard.kingston@ceva-dsp.com Web: https://mma.prnewswire.com/media/74483/ceva__inc__logo.jpg Financial data for CEVA, Inc. |
