Posthumous Recognition for Individuals who made Significant Contributions to Industry
MILPITAS , Calif. –– April 25, 202 2 –– The nomination deadline for the Phil Kaufman Hall of Fame for Distinguished Contributions to Electronic System Design has been extended to Friday, May 27, the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA), sponsors of the honor, announced today.
The honor posthumously recognizes individuals who made significant contributions to the industry and were not recipients of the Phil Kaufman Award. Deceased members of the community are not eligible to receive the Phil Kaufman Award, a policy set by the IEEE.
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Inaugural honorees awarded in 2021 were Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey, acknowledged for their significant and noteworthy contributions.
Selections for entry are determined through a nomination process and reviewed by the ESD Alliance and IEEE CEDA Kaufman Award selection committees. A special Phil Kaufman Hall of Fame page on the ESD Alliance and IEEE CEDA websites will host photos, citations and tributes to the selected inductees.
Inductees will be announced in June. The link to the nomination form can be found here. Nominations submitted in 2021 will be valid through 2023.
About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit www.semi.org/en/communities/esda to learn more.
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SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.
Stay in touch with IEEE CEDA
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www.ieee-ceda.org
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https://www.linkedin.com/groups/8343531Facebook:
https://www.facebook.com/ieeeceda/
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https://twitter.com/IEEECEDA
