HP Advances Automation for Additive Manufacturing, Showcases New Platform Capabilities

New features in HP 3D Process Center and HP 3D Center will enable manufacturing-critical quality management capabilities for improved performance and repeatability, and greater predictability. Customers taking advantage of these offerings will be able to tune their HP 3D printing systems for high-repeatability of specific applications, implement industrial-level process and quality controls at scale, and improve sustainability with tracing of raw material and quality of recycled material.

Furthering End-to-End Automation With New Unpacking Station

HP is also introducing the new industrial-grade HP Automatic Unpacking Station, developed together with Rösler Group’s AM Solutions, a world leader in the equipment, process technologies, and consumables for the automated post-processing and surface finishing of 3D parts. It will help customers using HP’s Jet Fusion 5200 systems reduce costs, achieve greater build consistency, and enhance performance across workflows.

Initial customers include Weerg, a leading Italian parts producer who is pushing the boundaries of 3D industrial production with its fleet of HP Jet Fusion 5200 systems. “We are excited for the continued automation advancements from HP and its partners like AM Solutions,” said Matteo Rigamonti , Founder, Weerg. “As we expand our business and manage a growing fleet of HP Jet Fusion systems these enhanced capabilities are designed to help us meet customer demand, and improve our turnaround times for high volume production parts.”

Learn M ore B y J oining HP at Formnext Connect

HP and its customers and partners will be participating in a variety of Formnext Connect sessions taking place November 10-11, 2020, including:

  • Advancing Post-Processing Automation in Additive Manufacturing (November 10 at 10:30 a.m. Central European Time) featuring Virginia Palacios, Market Development Director, HP 3D Printing and Digital Manufacturing, Manuel Laux, Head of Digital Transformation, Rösler Group’s AM Solutions and Francesco Zanardo, Director, Weerg showcasing the benefits of the new HP Automatic Unpacking Station .
  • Automating Digital Workflows (November 10 at 6:30 p.m. Central European Time) featuring Ryan Palmer, Global Head of Software, Data and Automation, HP Personalization & Industrial Business, Harshil Goel, CEO & Founder of Dyndrite, and Jill Christner, President and GM of the Americas, SLM Solutions, sharing more details on advanced software and data capabilities including the new HP Universal Build Manager Powered by Dyndrite.
  • Materials Innovation and Advanced Applications: p olypropolyne (PP) and thermoplastic polyurethane (TPU) (November 11 at 5 p.m. Central European Time) featuring María Tauler, HP 3D Printing Materials Product Manager, Julia Roth, Technical Manager, BASF, and Andreas Knöchel, Head of Program Management for Additive Manufacturing, Oechsler, highlighting new use cases made possible by HP High Reusability PP and Ultrasint® TPU01 enabled by BASF.
  • Discover the New Elastomer for Flexible Applications (November 11 at 6:30 p.m. Central European Time) featuring Virginia Palacios, Market Development Director, HP 3D Printing and Digital Manufacturing, Rebecca Facteau , Business Development Manager for Additive Manufacturing, Evonik, Jesse Lea, President, GoProto and Alex Pille, Product Development Manager, Fast Radius, highlighting new use cases made possible by the new HP 3D High Reusability TPA enabled by Evonik. Learn more about the new TPA and all of HP’s innovative materials here.

About HP
HP Inc. creates technology that makes life better for everyone, everywhere. Through our portfolio of personal systems, printers, and 3D printing solutions, we engineer experiences that amaze. More information about HP Inc. is available at  http://www.hp.com/go/3Dprinting

©Copyright 2020 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

 

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