1. Extended Temperature Range
Supports operating temperature range
of -40°C to +105°C. Reliability tests were conducted to meet AEC-Q100
Grade2 specifications, in addition to JEDEC compliance tests.
2. Wide Capacity Range
Supports wide capacity range from 16GB to
256GB. Suitable for a wide variety of automotive applications, such as
entertainment & information systems and ADAS, which typically require
high-capacity storage, as well as other applications (such as wireless
communication) that may need only smaller capacity.
3. High Performance
Realizes much higher performance compared to
Automotive e-MMC.
4. Additional Functions
Supports additional functions designed for
automotive applications, such as Refresh, Thermal Control and Extended
Diagnosis.
5. Integrated NAND Flash Memory Management
The JEDEC UFS V2.1
compliant interface handles essential functions, including bad block
management, error correction, wear leveling, and garbage collection. As
a result, UFS devices simplify design when compared to standalone memory
integrated circuits with a standard NAND flash interface.
Key Specifications
| Interface |
JEDEC UFS V2.1 standard
HS-G3 interface |
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| Capacity | 16GB, 32GB, 64GB, 128GB, 256GB | |||||||
|
Power Supply Voltage
|
2.7-3.6V
|
(Memory core)
|
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|
Temperature Range |
-40oC to +105oC |
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| Package |
153Ball FBGA
11.5mm x 13.0mm (16GB, 32GB, 64GB, 128GB) |
169Ball FBGA
12.0mm x 16.0mm (256GB) |
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