DesignCon 2018 Call for Papers Opens Mid-May
SAN FRANCISCO, April 18, 2017 — (PRNewswire) — DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces the recipients of its Best Paper Awards following a successful DesignCon 2017 in Santa Clara, CA, on January 19-21. The winners are recognized for their outstanding contribution to the diverse educational goals of DesignCon. To view the full list of winners, visit: http://ubm.io/2pvrEHk
The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation.
"Congratulations to all finalists and winners of this year's Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees," said Naomi Price, DesignCon Conference Content Director. "Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon."
Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:
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Chip-Level Design |
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Characterizing and Selecting the VRM |
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Steve Sandler, Picotest |
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Board/System-Level Design |
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FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter |
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Yunhui Chu, Intel Corporation |
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Alaeddin Aydiner, Intel Corporation |
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Kai Xiao, Intel Corporation |
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Beomtaek Lee, Intel Corporation |
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Dan Oh, Samsung Electronics |
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Oleg Mikulchenko, Intel Corporation |
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Adam Norman, Intel Corporation Rob Friar, Intel Corporation |
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Charles Phares, Intel Corporation |
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Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard |
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Heidi Barnes, Keysight Technologies |
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José Moreira, Advantest |
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Manuel Walz, Advantest |
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RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology |
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Masashi Shimanouchi, Intel Corporation |
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Hsinho Wu, Intel Corporation |
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Mike Peng Li, Intel Corporation |
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Serial Link Design |
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Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE |
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Jan B. Preibisch, Technische Universität Hamburg-Harburg |
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Torsten Reuschel, Technische Universität Hamburg-Harburg |
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Katharina Scharff, Technische Universität Hamburg-Harburg |
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Jayaprakash Balachandran, Cisco Systems Inc. |
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Bidyut Sen, Cisco Systems Inc. |
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Christian Schuster, Technische Universität Hamburg-Harburg |
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Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links |
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Yuhan Yao, Oracle Corporation |
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Xun Zhang, Oracle Corporation |
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Dawei Huang, Oracle Corporation |
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Jianghui Su, Oracle Corporation |
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Muthukumar Vairavan, Oracle Corporation |
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Chai Palusa, Oracle Corporation |
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PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link |
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Mohammad S. Mobin, Broadcom Ltd |
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Haitao Xia, Broadcom Ltd |
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Aravind Nayak, Broadcom Ltd |
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Gene Saghi, Broadcom Ltd |
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Christopher Abel, Broadcom Ltd |
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Lane Smith, Broadcom Ltd |
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Jun Yao, Broadcom Ltd |
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Power & RF Design |
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Cost-effective PCB Material Characterization for High-volume Production Monitoring |
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Yongjin Choi, Hewlett-Packard Enterprise |
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Christopher Cheng, Hewlett-Packard Enterprise |
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Yasin Damgaci, Hewlett-Packard Enterprise |
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Nagaraj Godishala, Hewlett-Packard Enterprise |
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Yuriy Shlepnev, Simberian |
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Overview and Comparison of Power Converter Stability Metrics |
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Joseph 'Abe' Hartman, Oracle |
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Alejandro 'Alex' Miranda, Oracle |
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Kavitha Narayandass, Oracle |
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Alexander Nosovitski, Oracle |
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Istvan Novak, Oracle |
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RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices |
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Antonio Ciccomancini Scogna, Samsung Electronics Mobile Division, HE Group |
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Hwanwoo Shim, Samsung Electronics Mobile Division, HE Group |
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Jiheon Yu, Samsung Electronics Mobile Division, HE Group |
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Chang-Yong Oh, Samsung Electronics Mobile Division, HE Group |
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Seyoon Cheon, Samsung Electronics Mobile Division, HE Group |
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NamSeok Oh, Samsung Electronics Mobile Division, HE Group |
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Dong Sub Kim, Samsung Electronics Mobile Division, HE Group |
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