Neoconix (booth 320) announces the availability of new DLBeam™ enhancements to its PCBeam™ connector products. Engineered specifically for high speed applications, the DLBeam construction utilizes a more streamlined electrical path with reduced capacitance to further improve signal integrity. DLBeam has been developed for data rates up to 56Gbps.
Novotech Technologies (booth 207) will showcase wireless products/solutions with a focus on the new CAT M technology which is predicted to be a true game changer for the Internet of Things.
Oak-Mitsui Technologies (booth 1244) is thrilled to announce the launch of its thinner product MC2TS which offers 40 nf/sq in capacitance and 18 Dk @1 KHz. MC2TS is perfect for small factor applications such as MEMs and modules with space limitation that require higher capacitance.
Cross-Correlator ASIC is one of Pacific Microchip Corp.'s (booth 1237) unique products that was developed under NASA SBIR contract. The ASIC has greatly reduced power consumption and includes an array of 128 ADCs with 2-bit precision sampled at 1 GHz and a 64x64 cross-correlation matrix based on a novel architecture.
PacketMicro (booth 755) is excited to showcase the complete hardware and software solution for Intel Delta-L+ test methodology that allows PCB manufacturers to easily measure the PCB loss and extract Dk and Df. This solution includes an R&S ZNB20 VNA, EMStar Advanced Interconnect Test Tool (AITT) software, and rugged handheld D-Probes.
Paricon Technologies (booth 400) will present its latest technologies in its new ribbon cable to board connector system which introduces minimal signal degradation between the cable and the PWB. Using its patented PariPoser® contact system, very high performance electrical interconnection capability can be obtained for a wide range of applications including test and production interconnection products.
PCB Droid (booth 1341) will display its easy-to-use and easy-to-learn 'WYSIWYG' printed circuit board design application for Android mobile devices. It has an ergonomic menu structure designed for touch screens, and offers an extended macro library.
Polliwog Corporation (booth 1057) will showcase DFx which allows users to reduce expense and loss of time occurring in a mass production cycle. Numerous electrical defect items are checked against the PCB design data, and any design errors are reported at the point of error so that they are easily identified and corrected.
Pulse Electronics' (booth 632) is excited to be displaying the Pulse JT7 product line of 1 x1, 1, 10GBASET ICM, 4P POE with options for 4 and 5 Channel magnetics, PH9400 SMT high isolation gate drive transformers, SMPTE292M Video Baluns and Militarized Ethernet and AFDX products.
RoBAT Ltd. (booth 200), is excited to announce the release of two new robotic test machines: The RCI machine is a fully automated 4-head high speed VNA/TDR tester for Backplane assemblies. The PDM machine will detect the presence of pressfit pins and backdrills on both Backplane and Daughtercard assemblies.
Rohde & Schwarz (booth 841) will be featuring test solutions for challenges in high speed digital design and signal integrity as well as power integrity measurement solutions. The setups cover crosstalk, PAM-4 measurements, high bit rate channel characterization, low noise probing for signal integrity, battery life analysis, and high speed PCB probing.
SIGLENT Technologies (booth 402) will be displaying its latest developments in oscilloscopes, DMMs, spectrum analyzers, and generators.
SL Power (booth 642) will showcase its external and internal power supplies that address the Department of Energy's (DOE's) Level VI efficiency requirements, as well as enhanced performance to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards for applications in test equipment, medical devices, and specialized LED lighting equipment.
Socionext (booth 1239) will feature advanced SoC design and solutions including ultra energy-efficient 56Gb/s PAM4 and 56Gb/s NRZ analog and ADC-based SR to LR CMOS transceivers, 100+Gbps transceiver utilizing the company's ultra-high speed ADC & DAC technology, and high-end package designs for high-performance SoCs.
Southwest Microwave (booth 411) will showcase its SuperMini Board-to-Board DC to 67 GHz blind-mate connectors for PCBs stacked as tightly as 3 mm. Southwest Microwave will also display its SuperSMA, 2.92, 2.40, 1.85, 1.0, and 0.9 mm End Launch Connectors and its matching cable and harness assemblies.
Spectra7 Microsystems (booth 803) will showcase the GaugeChanger and GaugeChanger Plus line of data center interconnects and components. Using Spectra7's patented active cable technology, the GaugeChanger series of ICs and cable modules enable the thinnest 3 meter and 5 meter QFSP cables used in rack-to-rack applications.
SPISim (booth T6) announces enhanced IBIS-AMI and link analysis capabilities in latest 2017.1 SPIPro release. Datasheet based cross-platform AMI models for FFE, CTLE, DFE and CDR stages can be configured and generated directly from SPIPro.
SV Microwave (booth 1055) manufactures a large variety of solderless precision RF connectors in high frequency bands including SMA, 2.92mm and 2.4mm connector series. Our solderless application makes assembly fast, easy and without damaging the PCB board. Additionally, SV can customize a PCB footprint design for your application.
T Plus Co. Ltd. (booth T4) will showcase 67GHz Wide pitch Probes, 40GHz Handheld probes, 26.5-170GHz standard RF probes and a variety of custom designed DC/RF probes. Additionally, T Plus Co. Ltd. will provide a Manual Probe Station as well as displayed measurement accessories.
Tektronix (booth 741) will be showcasing its comprehensive set of solutions for automated transmitter and receiver test solutions for data center technologies and emerging serial bus standards along with automated test solutions. Tektronix will also launch an exciting new product that will help engineers ease 4th generation receiver testing.
Teledyne LeCroy (booth 733) will showcase the HDO family of 12-bit high definition oscilloscopes; PAM4 signal analysis; digital power management IC, power sequencing, and power-integrity testing; USB 3.1 and Power Delivery compliance test over Type-C; MIPI M-PHY physical- and protocol-layer test; PCI Express Tx/Rx compliance; and DDR4 compliance and debug capabilities.
TestEquity (booth 648) provides value-added electronic test and measurement solutions, MRO tools, recently acquiring JENSEN® Tools, and in-house line of environmental test chambers. TestEquity works alongside customers to find the best solutions for specific needs, offer unmatched post-sale support and industry-leading warranties. TestEquity is an authorized stocking distributor for hundreds of leading manufacturers.
Total Phase (booth 603) will showcase the new Advanced Cable Tester - the quickest and most convenient way to test USB Type-C cables. The Advanced Cable Tester provides thorough continuity testing, DC resistance measurement for safe operation/reliability, and E-Marker verification. Rapid spot-checking of cables, easy-to-understand reports, and 100% test coverage are also features of this tester.
TOYO Corp. (booth 815) will be demonstrating the latest EMIStream Ver5.0 (EMI Simulation Software) from NEC and 67GHz near-field EMI scanner from Aprel. TOYO Corp. is also excited to showcase the latest PCB materials from Risho and high-frequency low-loss cables from Junkosha.
Ventec International (booth 118) will unveil the industry's most advanced ultra-low Dk PCB materials for high-speed low-loss applications. A technical presentation on the subject will demonstrate how lower losses and lower system power requirements are realized by using an ultra-low Dk material with Dk values between 2.3 and 2.8.
