|
Amounts in NT$ Millions |
3Q/16 |
2Q/16 |
3Q/15 |
|
Net Revenues |
34,832 |
31,180 |
32,489 |
|
Revenues by Packaging Type |
|
|
|
|
Bumping, Flip Chip, WLP
|
33% |
31% |
34% |
|
IC Wirebonding |
57% |
61% |
56% |
|
Discrete and Others |
10% |
8% |
10% |
|
Capacity |
|
|
|
|
CapEx (US$ Millions)* |
112 |
136 |
83 |
|
Number of Wirebonders |
15,905 |
15,920 |
15,617 |
Testing Operations
|
Amounts in NT$ Millions |
3Q/16 |
2Q/16 |
3Q/15 |
|
Net Revenues |
7,232 |
6,502 |
6,426 |
|
Revenues by Testing Type |
|
|
|
|
Final test |
75% |
77% |
76% |
|
Wafer sort |
21% |
20% |
20% |
|
Engineering test |
4% |
3% |
4% |
|
Capacity |
|
|
|
|
CapEx (US$ Millions)* |
57 |
107 |
25 |
|
Number of Testers |
3,725 |
3,629 |
3,417 |
EMS Operations
|
Amounts in NT$ Millions |
3Q/16 |
2Q/16 |
3Q/15 |
|
Net Revenues |
31,190 |
24,886 |
36,161 |
|
Revenues by End Application |
|
|
|
|
Communication |
51% |
46% |
56% |
|
Computer |
16% |
20% |
13% |
|
Consumer |
20% |
18% |
19% |
|
Industrial |
7% |
8% |
7% |
|
Automotive |
5% |
7% |
4% |
|
Others |
1% |
1% |
1% |
|
Capacity |
|
|
|
|
CapEx (US$ Millions)* |
10 |
4 |
24 |
|
* Capital expenditure excludes building construction costs. | |||
