NXP Semiconductors Reports Third Quarter 2016 Results

(1) Please see “Non-GAAP Financial Measures” on page 4 of this release

Additional Information for the Third Quarter 2016:

  • In recent months the U.S. Securities and Exchange Commission (“SEC”) has increased its focus on the general use of non-GAAP financial metrics and reporting by U.S. listed companies.  In May 2016, the SEC issued new and revised Compliance & Disclosure Interpretations that relate to the reporting of non-GAAP financial measures by all U.S. listed companies ( www.sec.gov/divisions/corpfin/guidance/nongaapinterp.htm).  As a result, NXP has re-evaluated its use of non-GAAP financial information, to ensure that when used in conjunction with its reported GAAP results, its non-GAAP financial information provides a clear reflection of the underlying operational performance of NXP.  Starting for the third quarter of 2016, NXP will limit its forward guidance to the following GAAP financial information; Revenue, Gross Profit, Operating Income, Financial Income and Expense, Non-Controlling Interest and Net Cash Paid for Income Taxes. In addition, NXP will limit the non-GAAP financial measures in its forward guidance and subsequent results to non-GAAP Gross Profit, non-GAAP Operating Income, and non-GAAP Financial Income and Expense.
  • On September 22, 2016 NXP refinanced its $1,440 million Term Loan F, due 2020 to a rate of Libor + 2.50%, without a floor from Libor + 3.00% with a 75 basis-point floor. The principle amount did not change.
  • On August 11, 2016 NXP issued a $1,000 million aggregate principle amount of 3.875% senior unsecured notes due 2022. NXP used the proceeds from the offering, together with cash on hand to redeem the remaining $960 million aggregate principle amount of outstanding senior secured notes due 2022, and to pay certain related financing costs.
  • On August 1, 2016, NXP issued a $500 million aggregate principle amount of 4.125% senior unsecured notes, as a tap issue to its existing 2021 senior notes. NXP used the proceeds from the offering to redeem the remaining $200 million aggregate principle amount of outstanding senior secured notes due 2016, and used the remainder of the proceeds for general corporate purposes. 
  • On August 8, 2016, NXP acquired certain mobile transaction assets and design engineers to complement our existing efforts. With this transaction, NXP reinforces its capabilities with a skilled engineering team focused on mobile applications.
  • In the third quarter of 2016, SSMC, NXP’s consolidated joint-venture wafer fab with TSMC, reported third quarter 2016 operating income of $41 million, EBITDA of $55 million and a closing cash balance of $275 million. During the quarter SSMC paid a previously announced dividend of $325 million.
  • In third quarter of 2016, utilization in the combined NXP wafer-fabs averaged 93 percent.
  • During the third quarter of 2016, NXP repurchased approximately 6.5 million shares for a total cost of approximately $555 million.  Weighted average number of diluted shares (after deduction of treasury shares) for the three month period ended October 2, 2016 was 344.4 million.
  • In the third quarter of 2016 net cash paid for interest was $57 million and net cash paid for income taxes was $19 million.

Supplemental Information ($ millions, unaudited) (1, 2, 3, 4)

                     
                     
     Q3 2016  Q2 2016  Q3 2015  Q3 2016
Reported
  Q3 2016
Combined Adj. Revenue
  
     As
Reported
  As
Reported
  As
Reported
  Combined
Adj. Revenue
  Q-Q  Y-Y  Q - Q  Y-Y  
                     
  Automotive $853  $858  $308  $811   -1%  177%  -1%  5%  
                                            
    Secure Identification Solutions (SIS)   $ 178     $ 200     $ 269     $ 269       -11 %     -34 %     -11 %     -34 %    
                                                         
    Secure Connected Devices (SCD)   $ 592     $ 514     $ 317     $ 623       15 %     87 %     15 %     -5 %    
                                                         
    Secure Interface & Infrastructure (SI&I)   $   476     $   442     $   270     $   485       8 %     76 %     8 %     -2 %    
                                                                         
    High Performance Mixed Signal (HPMS)   $ 2,099     $ 2,014     $ 1,164     $ 2,188       4 %     80 %     4 %     -4 %    
                                                         
    Standard Products (STDP)   $   320     $   303     $   325     $   323       6 %     -2 %     6 %     -1 %    
                                                         
    Product Revenue   $ 2,419     $ 2,317     $ 1,489     $ 2,511       4 %     62 %     4 %     -4 %    
                                                         
    Corporate & Other   $   50     $   48     $   33     $   40       4 %     52 %     4 %     25 %    
                                                         
    Total Revenue   $   2,469     $   2,365     $   1,522     $   2,551       4 %     62 %     4.4 %     -3.2 %    
                                         
                                         

« Previous Page 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11  Next Page »
Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise