Subsystems developed in conjunction with high-performance IP core provider Northwest Logic
SAN JOSE, Calif., May 31, 2016 — (PRNewswire) — Toshiba America Electronic Components, Inc. ( TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the immediate availability of PCI Express1 and DDR3 SDRAM2 IP subsystems3. Developed in conjunction with Northwest Logic, a leading provider of high-performance, easy-to-use, silicon-proven PCI Express® and Memory Interface IP cores, these subsystems are available on custom LSI platforms, including ASIC and FFSA™ 4.
The Northwest Logic PCI Express Cores include standard-compliant, full-featured PCI Express 3.0/2.1/1.1 Cores and high-performance, scatter-gather DMA5 Cores and Drivers (Linux® and Windows®). The DDR3 SDRAM Controller Core provides high-bandwidth support with a full set of optional add-on cores that include AXI6, multi-port, reordering7, error correction checking (ECC)8 and memory test support.
"We are excited to collaborate with Toshiba to provide complete PCI Express and DDR3 SDRAM Controller + PHY IP subsystems for the Toshiba FFSA and ASIC platforms. These pre-verified IP subsystems enable chip designers to quickly create high-performance, high-complexity SoC designs," said Brian Daellenbach, CEO of Northwest Logic.
"By combining the IP and expertise of our two companies, we are in a strong position to offer robust, value-added IP subsystem solutions and expert support to our customers – in turn, enabling them to bring their product to market more quickly," said Yukihiro Urakawa, technical executive, Toshiba Corp.
Added Doug Day, vice president of engineering, Design Solutions EDA and IP Development for TAEC, "Toshiba leverages comprehensive expertise, from design to manufacturing, to offer a wide range of custom LSI solutions. We developed FFSA to be an innovative, flexible custom LSI solution with pre-designed masters featuring customizable I/Os, SerDes, SRAMs and logic devices that can be configured according to customer requirements. Adding PCI Express and DDR3 Controller + PHY IP subsystems to our IP portfolio will further extend FFSA capabilities."
- PCI Express: I/O serial interface broadly used in computing systems.
- DDR3 SDRAM: DRAM standard used as the main memory for PCs and servers.
- IP subsystem: IP solution that consists of IP required to develop system LSI, and is designed for ease of implementation into a high-speed interface subsystem.
- FFAS (Fast Fit Structured Array) technology: Enables Toshiba to develop ICs with lower development costs and shorter development turnaround times by reducing the number of metal layers that must be customized.
- Scatter-gather DMA: Enables sequential transfer of discrete memory blocks.
- AXI (Advanced eXtensible Interface): The most widespread AMBA® on-chip communication interconnect specification.
- Reordering: Changing the order of memory operation to increase memory interface efficiency.
- ECC: Used to secure data reliability.
PCI Express is a registered trademark of PCI-SIG.
Linux is a registered trademark of Linus Torvalds in the U.S. and other countries.
Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries.
FFSA is a trademark of Toshiba Corporation.
AMBA is a registered trademark of ARM Ltd.
About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 4.0, 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (HBM, MRAM, DDR4/3/2, LPDDR4/3/2 SDRAM; RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit
www.nwlogic.com.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor, solid state drive and hard disk drive manufacturer and the world's seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 580 consolidated companies employing over 199,000 people worldwide. Visit Toshiba's web site at http://toshiba.semicon-storage.com.
© 2016 Toshiba America Electronic Components, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
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