Reduced Footprint of Dual Cool™ 88 MOSFET Boosts Power Density and Improves System Efficiency With a low Parasitic Package
SAN JOSE, Calif. — (BUSINESS WIRE) — August 26, 2015 — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance semiconductor solutions, today launched its industry-leading mid-voltage MOSFET technology in a Dual Cool™ 8mm x 8mm package. The new Dual Cool 88 MOSFET gives power conversion engineers a first-of-its-kind alternative to bulky D2-PAK packages at half the size and with higher power density, superior efficiency and better cooling via air flow above and beneath the package.
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“Fairchild's Dual Cool 88 products played a central part in delivering a winning solution to one of our key customers,” said Patrick del Castillo, CEO, Castle Creations, Inc. “The low profile, small footprint, and low Rds(on) of the Dual Cool 88 MOSFETs enabled us to provide the smallest board size and lowest solution cost, while delivering the highest efficiency in high power BLDC motor drive applications.”
“Between meeting industry regulations and consumer demand, manufacturers need to address the growing worldwide trend toward smarter, smaller and more efficient consumer and industrial devices,” said Mike Speed, Director of Product Marketing at Fairchild. “The Dual Cool 88 MOSFET delivers superior performance, power density and efficiency in a package half the size of D2-PAK devices to enable manufacturers to develop more efficient products while reducing their cost and improving reliability.”
Manufacturers can increase the efficiency of DC motors while reducing costs using the Dual Cool 88 packaging rather than MOSFETs in D2-PAK packages. Greater efficiencies with lower cost are enabled by the Dual Cool 88’s packages advantages over D2-PAK, including smaller size, thinner profile, and 93 percent lighter in weight, making them ideal for weight-sensitive applications such as drones and aero-modeling.
Compared to D2-PAK, the Dual Cool 88’s package also delivers faster switching, less EMI along with the higher power density, and lower parasitic losses. The reduced parasitic losses are achieved using source clip not wire bonds, ensuring high pulse current with 63 percent lower source inductance compared to D2-PAK devices.
The Dual Cool 88 is also easier to store, ship and handle as it is highly resistant to moisture, which often causes damaging delamination during storage. Its excellent MSL1 rating allows it to resist moisture without requiring the protected packaging of D2-PAK devices.
Availability
The Dual Cool 88 MOSFETs’ are available today
in distribution. For detailed product information, please visit
https://www.fairchildsemi.com/product-technology/dual-cool/.
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