"Micron is excited to offer a package-on-package (PoP) memory solution compatible with TI's TDA3x SoCs to enable automotive customers to create the next-generation of high performance miniaturized ADAS solutions," said Kris Baxter, senior marketing director for Micron's Embedded Business. "PoP memory solutions can enable very small size which is a requirement for many ADAS system and with TI's TDA3x SoC and Micron PoP memory this is now achievable."

"ISSI is pleased to work with one of the preeminent ADAS SoC suppliers in the market. Our partnership on TDA3x SoC PoP solution allows us to work together to provide very cost-effective and miniaturized system solutions," said Lyn Zastrow, vice president, automotive business unit, ISSI. 

"Winbond is honored to work with Texas Instruments and its new TDA3x SoC processors for automotive ADAS solutions," says Tung-Yi Chan, president, Winbond Electronics Corporation.  "Winbond is now offering new automotive grade memory solutions in Package-on-Package (PoP) that works seamlessly with TI's TDA3x SoC processors."

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/ti-continues-to-scale-sophisticated-innovation-into-adas-solutions-for-entry--to-mid--level-automobiles-569031194.html

SOURCE Texas Instruments