TOKYO — (BUSINESS WIRE) — September 2, 2014 — Toshiba Corporation (TOKYO:6502) today announced the launch of a transistor output photocoupler in a low-height SO6L package, which can be used to replace conventional DIP4 pin package products. Shipment will start from today.

Toshiba: Low-height Package Transistor Output Photocoupler "TLP385" (Photo: Business Wire)

The new product “TLP385” has an isolation specification equivalent to DIP4 F (wide lead) type package products, and guarantees a creepage and clearance distance of 8mm (min), and isolation voltage of 5kVrms (min).

With its low height of 2.3mm (max), a 45% reduction from DIP4 type package products, the new “TLP385” can be used in situations where there are strict height restrictions, such as on motherboards, and contribute to the development of smaller sets. It can be used for applications including inverter interfaces and general-purpose power supplies.

Follow this link for more on Toshiba photocouplers.
http://www.semicon.toshiba.co.jp/eng/product/opto/coupler/index.html

Customer Inquiries:
Optoelectronic Device Sales & Marketing Department
Tel: +81-3-3457-3431

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

About Toshiba

Toshiba Corporation, a Fortune Global 500 company, channels world-class capabilities in advanced electronic and electrical product and systems into five strategic business domains: Energy & Infrastructure, Community Solutions, Healthcare Systems & Services, Electronic Devices & Components, and Lifestyles Products & Services. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations towards securing “Growth Through Creativity and Innovation”, and is contributing to the achievement of a world in which people everywhere live in safe, secure and comfortable society.