Renesas Electronics Announces R-Car M2 with Increased Performance for Mid-Range Automotive HMI, Infotainment, and Integrated Dashboard Solutions

Pricing and Availability

Samples of the Renesas R-Car M2 SoC are available now, equipped in an 831-pin FCBGA (flip chip ball grid array) package. Mass production is scheduled to begin in June 2015 and is expected to reach a combined production volume of 500,000 units per month by June 2016. A low-cost development board implementing the R-Car M2 will be available from December 2013. (Availability is subject to change without notice.)

(Note 1) DMIPS (Dhrystone Million Per Second): One of the computer performance index calculated from Dhrystone benchmark program.

(Note 2) Ecosystem: The collectivity of development tools such as OS, compiler and debugger, developers, and solution providers focusing on a CPU architecture.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE:6723), the world’s number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at www.renesas.com.

(Remarks) A PowerVR SGX is a registered trademark of Imagination Technologies in the EU and other countries. ARM and Cortex are registered trademarks or trademarks of ARM Limited. Other product and service names that appear in this press release are trademarks or registered trademarks of their respective owners.



Contact:

Voce Communications, a Porter Novelli Company
Jessica Kerr, 415-975-2213
Email Contact



« Previous Page 1 | 2             
Featured Video
Jobs
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise