Navitas and SHINRY Accelerate New-Energy Vehicle Developments with Next-Gen Power Semiconductors

ROHM’s Compact SOT-223-3 600V MOSFETs Contribute to Smaller, Lower Profile Designs for Lighting Power Supplies, Pumps, and Motors

Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package

Teledyne Technologies Reports Fourth Quarter Results

TI reports Q4 2023 and 2023 financial results and shareholder returns

SEALSQ Announces an Initiative Focused on Semiconductor Personalization Centers, SEALCOINS Incentivization, and Advanced IoT Integration Aiming to Mitigate Global Dependency on Semiconductor Manufacturing and Fortify Microchip Deployment Ca

Brett Walkenhorst, CTO Bastille

Thomas Jimenez, UAS Market Director Kongsberg Geospatial

Migel Tissera, CTO Metaspectral

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Equipment Engineer, Raxium for Google at Fremont, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Senior Principal Software Engineer for Autodesk at San Francisco, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024