With 3Brain AG's Accura-3D microchip, a first-in-class cell-electronic interface enters the market

Navitas Semiconductor Announces Second Quarter 2022 Financial Results and Acquisition of GeneSiC, an Industry-leading SiC Company

Navitas Semiconductor, Industry-Leader in Gallium Nitride Power ICs, Announces Acquisition of GeneSiC Semiconductor, Silicon Carbide Pioneer

SkyWater Technology Reports Second Quarter 2022 Results

OMNIVISION Commercializes World’s Smallest Pixel in New 200MP Image Sensor with Superior Low-light Performance for High-end Smartphones

onsemi Celebrates Expansion of Silicon Carbide Production Facility in New Hampshire

Douglas Reichard, Market Manager Trimble

Marc Goldman, Director, AEC Industry Esri

Thomas Jimenez, UAS Market Director Kongsberg Geospatial

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

GISCafe Voice by Sanjay Gangal A Breakthrough in UAV Lidar: Teledyne Geospatial and Inertial Labs Launch EchoONE, an NDAA-Compliant, Lightweight Solution

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Principal Engineer for Autodesk at San Francisco, California

Equipment Engineer, Raxium for Google at Fremont, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024