Acromag's New XMC Module Combines a Reconfigurable Artix®-7 FPGA with High-Density Digital and Analog I/O

FLEX LOGIX COLLABORATING WITH MICROSOFT TO HELP BUILD SECURE STATE-OF-THE-ART CHIPS FOR US DEPARTMENT OF DEFENSE (DOD)

Everspin to Showcase New STT-MRAM Products at Embedded World 2022 June 21-23, CEO to present details on IoT and FPGA focused MRAM

CAES announces Space Grade Qualification of Quad Core LEON4FT Microprocessor

Valens Semiconductor's Stello Chipsets to Power Crestron's Next-Generation Product Lines

Metalenz and STMicroelectronics deliver world's first optical metasurface technology for consumer electronics devices

Sagar Dubey, Product Manager ICEYE

Google Keynote (Google I/O ‘24) Google

Jakub Karas, Director UAS UpVision

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

Business Technology Analyst for Surface Water Management at Everett, Washington

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Mechanical Engineer 2 for Lam Research at Fremont, California

Principal Engineer for Autodesk at San Francisco, California

Equipment Engineer, Raxium for Google at Fremont, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024