Teledyne Technologies Reports Second Quarter Results

Teledyne e2v’s new 8K image sensor delivers wide FOV for high-throughput logistics vision systems

Teledyne e2v HiRel Announces New RF Low Noise Voltage Controlled Oscillators for Space Applications

Teledyne LeCroy Releases SimPASS™ USB Allowing USB4 Gen4 Pre-Silicon Verification

Teledyne Labtech Announces New Advanced Graphite Embedding Capability for PCB Thermal Management

Teledyne e2v HiRel Announces New 100 V High-Speed 20 MHz FET and GaN Transistor Driver Flip Chip Die

Thomas Jimenez, UAS Market Director Kongsberg Geospatial

Douglas Reichard, Market Manager Trimble

Eric Sindelar, EVP of Business Development Source Code

GISCafe Voice by Sanjay Gangal A Breakthrough in UAV Lidar: Teledyne Geospatial and Inertial Labs Launch EchoONE, an NDAA-Compliant, Lightweight Solution

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

Business Technology Analyst for Surface Water Management at Everett, Washington

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Principal Engineer for Autodesk at San Francisco, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024