New AMD Radeon PRO W6000X Series GPUs Bring Groundbreaking High-Performance AMD RDNA 2 Architecture to Mac Pro

AMD Leads High Performance Computing Towards Exascale and Beyond

With AMD FidelityFX Super Resolution, AMD Brings High-Quality, High-Resolution Experiences to Gamers Worldwide

AMD President and CEO Dr. Lisa Su to Keynote COMPUTEX 2021

Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge

Mavenir and Xilinx Collaborate to Bring to Market Open RAN Massive MIMO Portfolio

Danny Petrecca, VP Locusview

Mike Klonsinski, President Berntsen

Mario Genest, CEO AYE3D

GISCafe Voice by Sanjay Gangal A Breakthrough in UAV Lidar: Teledyne Geospatial and Inertial Labs Launch EchoONE, an NDAA-Compliant, Lightweight Solution

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Technology Analyst for Surface Water Management at Everett, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Principal Engineer for Autodesk at San Francisco, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024