World’s First USB PD E-Marker Transmission Line Control IC, EJ903, Now Certified by USB-IF for USB4™ and Intel for Thunderbolt™4

S2C Announces 300 Million Gate Prototyping System with Intel® Stratix® 10 GX 10M FPGAs

SOLiD and Intel Alliance Leverages Intel mDR and FPGA Technology to Develop 5G mmWave Repeaters

Intel Editorial: Sparking the Next Era for the Intel Brand

Intel Launches World’s Best Processor for Thin-and-Light Laptops: 11th Gen Intel Core

Intel Collaborates with Argonne National Laboratory, DOE in Q-NEXT Quantum Computing Research

Cloudpoint CEO on cloud adoption and Campus GIS Cloudpoint Geospatial

OSINT & Geospatial Data for Situational Awareness PenLink

Quantum, Cloud and LiFi with Tom Lash, CEO Vibrint

GISCafe Voice by Sanjay Gangal A Breakthrough in UAV Lidar: Teledyne Geospatial and Inertial Labs Launch EchoONE, an NDAA-Compliant, Lightweight Solution

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Principal Engineer for Autodesk at San Francisco, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024