SensiML Delivers AI-Based Sensor Algorithms for IoT Endpoints Using NXP's i.MX RT Crossover MCUs

AKHAN Semiconductor Announces Major European Patent

Samsung Introduces Best-in-class Data Security Chip Solution for Mobile Devices

Samsung Introduces Best-in-Class Data Security Chip Solution for Mobile Devices

Intel World Open: Path to Tokyo Kicks Off in March

Alpha and Omega Semiconductor Unveils a New Series of Intelligent MOSFET Power Modules

Mike Klonsinski, President Berntsen

Tony Ibanez, Federal Solutions Architect Ocient

Migel Tissera, CTO Metaspectral

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Senior Principal Software Engineer for Autodesk at San Francisco, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Engineer 2 for Lam Research at Fremont, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024