Broadcom Unveils Automation.ai, the Industry’s First AI-driven Platform that Accelerates Digital Business Decision-Making and Execution

ISSI introduces an Integrated 15 Channel Capacitive Touch controller with LED/LCD Display Driver

Broadcom Ships Tomahawk 4, Industry’s Highest Bandwidth Ethernet Switch Chip at 25.6 Terabits per Second

Rambus Completes Acquisition of the Verimatrix Silicon IP, Secure Protocols and Provisioning Business

Marvell Completes Divestiture of Wi-Fi Connectivity Business to NXP

Keysight, Marvin Test Solutions Collaborate to Speed Manufacturing of mmWave Semiconductors

Mario Genest, CEO AYE3D

Robert Renzoni, Director Technical Sales Federal Hammerspace

Sagar Dubey, Product Manager ICEYE

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Technology Analyst for Surface Water Management at Everett, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Principal Engineer for Autodesk at San Francisco, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024