New CAPZero-3 X-Capacitor Discharge ICs from Power Integrations Meet IEC60335

Cerebras Systems Unveils the Industry’s First Trillion Transistor Chip

Applied Materials Announces Third Quarter 2019 Results

Arm, WDC and Qualcomm Announce OpenChain Conformance Activities

Mouser Electronics and Grant Imahara Launch 2019 Empowering Innovation Together Series, “Engineering Big Ideas”

Thermo Fisher Scientific Introduces Scalable Solution for Optical Fault Isolation of Semiconductor Devices

Danny Petrecca, VP Locusview

Jakub Karas, Director UAS UpVision

Douglas Reichard, Market Manager Trimble

GISCafe Voice by Sanjay Gangal A Breakthrough in UAV Lidar: Teledyne Geospatial and Inertial Labs Launch EchoONE, an NDAA-Compliant, Lightweight Solution

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Mechanical Engineer 2 for Lam Research at Fremont, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Principal Engineer for Autodesk at San Francisco, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024