DMC2019, a trendsetter in the world of mold R&D, to be held at the Shanghai National Exhibition and Convention Center in June

ANSYS 2019 R2 Strengthens Digital Thread Between Design, Engineering and Manufacturing

HP Elevates Premium and Personalized PC Experiences

Global CAM Software Market to Reach $3.57 Billion by 2025 at 7.0% CAGR, Says Allied Market Research

HP Inc. Reports Fiscal 2019 Second Quarter Results

Sandvik Creates First 3D Printed Diamond Composite

Mike Klonsinski, President Berntsen

Sagar Dubey, Product Manager ICEYE

Sam Hashemi, CEO Felt

GISCafe Voice by Sanjay Gangal At Trimble Dimensions, AI Shifts from Hype to Practical Applications

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Senior Principal Software Engineer for Autodesk at San Francisco, California

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Engineer 2 for Lam Research at Fremont, California

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024

Coastal GeoTools 2025 Conference at 301 North Water Street - Jan 27 - 30, 2025

Commercial UAV Expo Europe 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025