ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies

eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019

eSilicon, Samtec and Wild River Technology Offer High-Performance Communications Webinar

eSilicon to Participate in Panel Discussion on Chiplet Design Experience at a Workshop presented by the Open Compute Project (OCP)

eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip

 eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip

Mario Genest, CEO AYE3D

Robert Renzoni, Director Technical Sales Federal Hammerspace

Sagar Dubey, Product Manager ICEYE

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Business Technology Analyst for Surface Water Management at Everett, Washington

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024