OneSpin’s Unique Hardware Metric Calculation App Boosts Automation of Failure Modes, Effects and Diagnostics Analysis (FMEDA) for Complex Automotive SoCs

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Synopsys and Palma Ceia SemiDesign Collaborate to Develop a Complete Hardware/Software NB-IoT IP Solution

GOWIN Semiconductor Announces Release of the New GOWIN EDA Tools for Improved Performance on New FPGA Product Families

MEDIA ALERT: RISC-V Comes to DVCon

Metrics Extends Cloud-Based Open Platform Ecosystem with Concept Engineering Debugger and Viewer

Mike Klonsinski, President Berntsen

Migel Tissera, CTO Metaspectral

Tim Klawa , Head of Product Figure Eight Federal

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

Business Technology Analyst for Surface Water Management at Everett, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Equipment Engineer, Raxium for Google at Fremont, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024