intoPIX Introduces the New JPEG XS Standard at CES

SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash® Memory on UMC’s 55 nm Platform

Arasan Announces availability of its Total I3C IP Solution for Xilinx FPGA's

Magewell Ships 4K HDMI to NDI® Encoder and Unveils New HD Model

Create Small Form Factor 10G Passive Optical Network Applications with Microchip's PolarFire FPGA Burst Mode Receiver

Efinix® Drives AI Edge Computing with Trion™ T20 FPGA Samples and Expansion of Product Offering to 200K LEs with T200 FPGA

Mario Genest, CEO AYE3D

Sagar Dubey, Product Manager ICEYE

Tim Klawa , Head of Product Figure Eight Federal

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Business Technology Analyst for Surface Water Management at Everett, Washington

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Principal Engineer for Autodesk at San Francisco, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024