eInfochips Showcases AI Inferencing at the Edge Solution at Embedded World 2022 with Qualcomm

Qualcomm and Nokia Complete 5G NR mmWave and Sub-6 GHz Over-the-Air (OTA) Interoperability Test Calls in Preparation for Commercial 5G Deployments in Early 2019

Qualcomm Launches $100M AI Investment Fund

Allegro DVT Launches a New High-performance, Multi-format Video Encoder IP for 4K/UHD Video Resolutions and Beyond

First 12-bit, 29-kHz RGB LED driver family enables vivid color and seamless animation with zero audible noise

Argon Design Licenses Argon Streams AV1 to Realtek Semiconductor

Sagar Dubey, Product Manager ICEYE

Mike Winn, CEO DroneDeploy

Thomas Jimenez, UAS Market Director Kongsberg Geospatial

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Business Technology Analyst for Surface Water Management at Everett, Washington

Principal Engineer for Autodesk at San Francisco, California

Equipment Engineer, Raxium for Google at Fremont, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024