TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman

GUC Monthly Sales Report - May 2018

Sankalp Semiconductor to Exhibit at Design Automation Conference – 2018

Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion, SEMI Reports

PathPartner to showcase innovations in face recognition and automotive vision at TU-Automotive, Detroit 2018

TrendForce Reports Top 10 Semiconductor Foundries Worldwide for 1H18, TSMC Ranks First with an Estimated Market Share of 56.1%

Quantum, Cloud and LiFi with Tom Lash, CEO Vibrint

Patrick Gill, SVP & GM EagleView

James Perry, Executive VP ASTERRA

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Principal Engineer for Autodesk at San Francisco, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024