Sankalp Semiconductor to Exhibit at Design Automation Conference – 2018

Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion, SEMI Reports

PathPartner to showcase innovations in face recognition and automotive vision at TU-Automotive, Detroit 2018

TrendForce Reports Top 10 Semiconductor Foundries Worldwide for 1H18, TSMC Ranks First with an Estimated Market Share of 56.1%

USB-IF Publishes HID Standard for Braille Displays

Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5

Douglas Reichard, Market Manager Trimble

Tony Ibanez, Federal Solutions Architect Ocient

Quantum, Cloud and LiFi with Tom Lash, CEO Vibrint

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Equipment Engineer, Raxium for Google at Fremont, California

Mechanical Engineer 3 for Lam Research at Fremont, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024