IEEE GlobalSpec Joins Rensselaer Polytechnic Institute (RPI) and the Advanced Robotics Manufacturing (ARM) Institute to Advance Robotics Technology Development

Truphone Brings New Integrated SIM Solution to Life With Synopsys ARC Secure IP Subsystem

Green Hills Software Extends Its Trusted Instrument Cluster Solutions to Renesas Electronics' R-Car D3 System-on-Chip

Truechip Announces First Customer Shipment of PCIe Gen 5 and JESD204C Verification IP

AccelerComm and Achronix Enable Fast Time to Market with 5G Polar Code for Speedcore eFPGAs

Renesas Electronics Delivers R-Car V3H System-On-Chip for Automotive Front Cameras in Level 3 and Level 4 Autonomous Vehicles

Mike Klonsinski, President Berntsen

Brett Walkenhorst, CTO Bastille

Mario Genest, CEO AYE3D

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Business Technology Analyst for Surface Water Management at Everett, Washington

Equipment Engineer, Raxium for Google at Fremont, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024