DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly

Socionext to Showcase Advanced SoC Design Solutions at DesignCon 2019

TE Connectivity to showcase high-speed Innovations at DesignCon 2019

DesignCon 2019 Debuts New Track Exploring Real World Machine Learning and Artificial Intelligence Deployment for Hardware Design

DesignCon 2018 Honors Dr. Mike Peng Li with Engineer of the Year Award

Credo Demonstrates Robust 112G PAM4 Single Lane Electrical SerDes Techology at DesignCon 2018

Douglas Reichard, Market Manager Trimble

Tony Ibanez, Federal Solutions Architect Ocient

Quantum, Cloud and LiFi with Tom Lash, CEO Vibrint

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Principal Engineer for Autodesk at San Francisco, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024