Inspur Unveiled GX4, A New Flexible and High Scalability AI Accelerating Box at ISC 2017

eSilicon at DAC 2017: 2.5D/HBM2 FinFET ASIC & IP Solutions for High-Bandwidth Networking, Computing, AI and 5G Infrastructure

Magewell to Launch Low-Power M.2 Capture Cards for OEM Applications at InfoComm 2017

Valens Announces Availability of VA6000 Automotive Chipset for the Ultimate Infotainment Experience

Advanced Semiconductor Engineering, Inc. Announces Monthly Net Revenues

VeriSilicon’s Artificial Intelligence Engine Powers Multi-Sensory Experiences in NXP’s i.MX 8 Flagship Applications Processor

Google Keynote (Google I/O ‘24) Google

Danny Petrecca, VP Locusview

Sagar Dubey, Product Manager ICEYE

GISCafe Voice by Sanjay Gangal A Breakthrough in UAV Lidar: Teledyne Geospatial and Inertial Labs Launch EchoONE, an NDAA-Compliant, Lightweight Solution

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Equipment Engineer, Raxium for Google at Fremont, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024