Chips&Media and Goke Microelectronics partner to provide video codec IP

Xilinx Announces Production Milestone for 16nm UltraScale+ Portfolio Ahead of Schedule

Faraday’s PowerSlash™ IP Now Available on UMC’s 55nm Ultra-Low-Power IoT Platform

Aldec to Highlight ASIC Pre-Silicon Verification Spectrum with Network-On-Chip (NoC) Demonstration at DVCon Europe

Samsung Mass Produces Industry's First Application Processor for Wearable Devices Built on 14-Nanometer FinFET Technology

CSEM licenses IcyTRX™ Bluetooth Low Energy silicon RF IP to Oticon for use in advanced hearing aids

Quantum, Cloud and LiFi with Tom Lash, CEO Vibrint

Patrick Gill, SVP & GM EagleView

James Perry, Executive VP ASTERRA

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Principal Engineer for Autodesk at San Francisco, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024