Samsung Announces Chip-on-Board LED Packages with Industry’s Highest Efficacy

Leading IC Design House Sondrel Continues Global Expansion with New Office in USA

Fujitsu Semiconductor and Synopsys Deliver an Optimized and Predictable Customized SoC (ASIC) Design Flow

Synopsys Announces Immediate Availability of Multiprotocol DesignWare Enterprise 12G PHY IP

Dune HD Selects Broadcom High Definition SoC for Satellite Set-top Boxes

PLX Technology PCI Express 3.0 Switch Provides Powerful Interconnect in New Fujitsu Storage ETERNUS DX S3 Series

Mario Genest, CEO AYE3D

Robert Renzoni, Director Technical Sales Federal Hammerspace

Sagar Dubey, Product Manager ICEYE

The GIS Lens by Sanjay Gangal Esri and Autodesk Push the Boundaries of AECO Design with Groundbreaking Integration of ArcGIS Data into Autodesk Forma

GISCafe Guest by Sanjay Gangal Building a 3D Future: How Bentley Systems and Cesium are Transforming Infrastructure Through Open-Source Innovation

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

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GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024