Silicom Launches New Family of Encryption & Compression Cards Based on Intel® Communications Chipset 89xx Series

G.Skill is first memory module manufacturer to have high speed, low power SO-DIMMs Advanced Tested on Intel® NUC platform

Intel Brings Supercomputing Horsepower to Big Data Analytics

Supermicro® Unveils New 2-Node 4U FatTwin™ Supporting 12x Intel® Xeon Phi™ Coprocessors and New TwinPro™ Platforms featuring 12Gb/s SAS 3.0 and NVMe at Supercomputing 2013

Intel Announces First Commercial Availability of 4G LTE Modem; Introduces Module for 4G Connected Tablets and Ultrabooks™

Kay Chai Ang Appointed Socle’s New Chairperson

Cloudpoint CEO on cloud adoption and Campus GIS Cloudpoint Geospatial

Sagar Dubey, Product Manager ICEYE

Myles Sutherland, CEO GeoCam

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Principal Engineer for Autodesk at San Francisco, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024