Actions Semiconductor Launches High Performance OWL Series Chipset

MEDIA ALERT: eSilicon CEO Jack Harding to Present at the 22nd Annual International Electronics Forum in Dublin, Ireland

IAR Systems Updates Leading Development Tools for the Ultra-Low-Power MSP430 Core from Texas Instruments

New Toshiba Converter Chipset Drives Next-Generation, DSI-Ready LCD Displays For Consumer Electronics And Industrial Applications

Renesas Electronics Introduces New Advanced Low-Power SRAM Products Contributing to Improved Reliability for Manufacturers’ Systems

New Spectra7 Chip Delivers Seamless Tablet to TV Connectivity

Vehicle-mounted cameras for power grid insights Noteworthy AI

Mike Klonsinski, President Berntsen

Danny Petrecca, VP Locusview

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Principal Engineer for Autodesk at San Francisco, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024