Efficient Power Conversion (EPC) Introduces High Current Development Board Featuring Multiple Half-Bridges in Parallel

Anritsu VectorStar Part of Technical Workshop Conducted by DuPont Circuit & Packaging Materials and Rogers Corporation at DesignCon 2014

Bruker Corporation Launches ContourSP 3D Optical Microscope for PCB Industry

Natel Acquires Leading Electronic Manufacturing Solutions Provider EPIC Technologies

Mentor and ASSET Deliver IJTAG Automated Chip-to-System-Level IP Integration

Leading High-Volume Printed Circuit Board Fabricator Selects Semblant Plasma Finish (SPF)

Douglas Reichard, Market Manager Trimble

Patrick Gill, SVP & GM EagleView

Vehicle-mounted cameras for power grid insights Noteworthy AI

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Mechanical Engineer 2 for Lam Research at Fremont, California

Mechanical Engineer 3 for Lam Research at Fremont, California

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024