Cadence Receives Three TSMC Partner of the Year Awards for Design IP, 16nm FinFET and 3D-IC Solutions

Cadence Digital and Custom/Analog Tools Included in TSMC Reference Flows to Enable 16nm FinFET Designs

TSMC and Cadence Deliver 3D-IC Reference Flow for True 3D Stacking

Cadence Offers Secure Digital 4.0 Host Controller IP Core

Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica HiFi Audio/Voice DSP IP

Cadence Announces Industry's First Verification IP for HDMI 2.0

Douglas Reichard, Market Manager Trimble

Patrick Gill, SVP & GM EagleView

Vehicle-mounted cameras for power grid insights Noteworthy AI

The GIS Lens by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

GISCafe Guest by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California

Senior Principal Software Engineer for Autodesk at San Francisco, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Engineer 2 for Lam Research at Fremont, California

URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024

2024 Pacific GIS and Remote Sensing Users Conference at Fiji - Nov 25 - 29, 2024

SWS Vienna GREEN 2024 "Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences at Vienna Austria - Nov 27 - 30, 2024

Smarter Data Smarter World 2024 featuring GeoIM for Infrastructure at United Kingdom - Dec 4, 2024