Panel of Experts to Discuss Design and Lithography Challenges for 22-nm Manufacturing

SAN JOSE, Calif., May 25 — (PRNewswire) — D2S™, an emerging supplier of computational design platforms, today announced that Aki Fujimura, chairman and CEO of the company, will participate in a 22-nm manufacturing panel during the 47th Design Automation Conference (DAC) at the Anaheim Convention Center in Anaheim, Calif.  DAC is the world's leading technical conference and tradeshow covering the latest trends in electronic design and design automation, and will be held June 13-18.  Aki Fujimura will participate in the Pavilion Panel "Hogan's Heroes: What Design and Lithography Nightmares will 22nm Bring?" under the topic "New and Emerging Technologies," to be held on Tuesday, June 15 from 10:30 a.m. to 11:30 a.m. at booth #694.

Moderator for the "Hogan's Heroes" panel will be Jim Hogan, 30-year industry veteran and luminary.  Aki Fujimura will be joined by industry experts Aaron Thean of Qualcomm, Inc. and Xin Wu of Xilinx, Inc. to provide their individual perspectives on the most critical lithography issues and the semiconductor industry's transition to the 22-nm node, as well as which innovations and design rules are likely to prevail and the impact on cost, performance, power and time-to-market.  

About D 2 S, Inc.

D2S is an emerging company providing a computational design platform to maximize existing e-beam technology to reduce mask costs for both low- and high-volume applications.  D2S advanced design-for-e-beam (DFEB) mask solution reduces mask write times for high-volume designs with complex and circular features using existing e-beam mask writing equipment   D2S DFEB direct write solution virtually eliminates the costs of masks for low-volume applications and can speed time-to-market by shortening the design-to-lithography process flow.  D2S is the managing sponsor of the eBeam Initiative.  Headquartered in San Jose, Calif., the company was founded in 2007.  For more information, see: www.design2silicon.com.

D2S™ is a trademark of D2S, Inc.

SOURCE D2S, Inc.