Intel announced delivery of the first multi-chip package (MCP) prototypes created under the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program. Awarded the U.S. Department of Defense (DOD) contract in 2020, Intel developed and supplied the prototypes six quarters ahead of schedule, showcasing the company’s commitment to customers while further supporting the DOD’s mission to return the U.S. to a leading role in the microelectronics ecosystem.
“Intel's first multi-chip package under the SHIP program leverages Intel’s core strength of product and process technology leadership as well as our robust industry partnerships, which are driving the development of new chiplet ecosystems. Through a close partnership with BAE and the U.S. government, we were able to deliver the prototype six quarters ahead of schedule. Intel is proud to have these critical technology capabilities here in the U.S., which are necessary to quickly develop and build products essential to our defense and national security.”
The prototype delivery marks a significant step in assuring access to state-of-the-art microelectronics packaging and in creating pathways to modernization for the DOD. With Intel, the Department of Defense and the defense industrial base can better diversify its supply chain and protect its intellectual property while also supporting ongoing semiconductor R&D in the U.S. and preserving critical capabilities domestically.
Intel’s advanced MCP capabilities – deliver up to 10 times the size, weight and power advantage compared to any other product on the market today – providing the flexibility and deployment speed Intel’s customers need to quickly transform and transition defense systems. The SHIP program will continue to develop prototypes of multi-chip packages; to improve chiplet size, weight, power and performance; and to accelerate advancement of interface standards, protocols and security for heterogeneous systems.
The SHIP program provides the U.S. government access to Intel’s advanced heterogeneous packaging technologies, including embedded multi-die interconnect bridge (EMIB), 3D Foveros and Co-EMIB. This access enables the Defense Department and the defense industrial base to leverage advanced semiconductor packaging and chiplet libraries, and to quickly specify, prototype, build, test and incorporate advanced devices into field equipment.
Department of Defense Celebrates Advancements in Microelectronics Packaging Capabilities
