OmniVision Unveils World’s First Automotive Wafer-Level Camera Module, Enabling Better Driver Monitoring Systems in More Vehicles

Reflowable CameraCubeChip™ Module Is One of World’s Smallest Automotive Cameras; Provides One-Stop Shop for Driver Monitoring Hardware With Best-in-Class Imaging Performance in Total Darkness

SANTA CLARA, Calif. — (BUSINESS WIRE) — June 2, 2020 — OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OVM9284 CameraCubeChip™ module—the world’s first automotive-grade, wafer-level camera. This 1 megapixel (MP) module has a compact size of 6.5 x 6.5mm to provide driver monitoring system (DMS) designers with maximum flexibility on placement within the cabin while remaining hidden from view. Additionally, it has the lowest power consumption among automotive camera modules—over 50% lower than the nearest competitor—which enables it to run continuously in the tightest of spaces and at the lowest possible temperatures for maximum image quality.

The OVM9284 is built on OmniVision’s OmniPixel®3-GS global-shutter pixel architecture, which provides best-in-class quantum efficiency at the 940nm wavelength for the highest quality driver images in near or total darkness. The integrated OmniVision image sensor has a 3 micron pixel and a 1/4" optical format, along with 1280 x 800 resolution.

“The accelerated market drive for DMS is expected to generate a 43% CAGR between 2019 and 2025(1),” asserted Pierre Cambou, Principal Analyst, Imaging from Yole Développement. “DMS is probably the next growth story for ADAS cameras as driver distraction is becoming a major issue and has brought regulator attention.”

“Most existing DMS cameras use glass lenses, which are large and difficult to hide from drivers to avoid distraction, and are too expensive for most car models,” said Aaron Chiang, marketing director at OmniVision. “Our OVM9284 CameraCubeChip module is the world’s first to provide automotive designers with the small size, low power consumption and reflowable form factor of wafer-level optics.”

The OVM9284’s integration of OmniVision’s image sensor, signal processor and wafer-level optics in a single compact package reduces the complexity of dealing with multiple vendors, and increases supply reliability while speeding development time. Furthermore, unlike traditional cameras, all CameraCubeChip modules are reflowable. This means they can be mounted to a printed circuit board simultaneously with other components using automated surface-mount assembly equipment, which increases quality while reducing assembly costs.

OVM9284 module samples are available now, and mass production is expected in Q4 of 2020. For more information, contact your OmniVision sales representative at www.ovt.com/contact-sales.

A virtual demo and Q&A for the OVM9284 will be available at AutoSensONLINE’s virtual demo sessions, on Friday, June 12th at 10:40am (Eastern). Register for free, here: https://auto-sens.com/autosens-online-tickets.

About OmniVision

OmniVision Technologies, Inc. is a leading developer of advanced digital imaging solutions. Its award-winning CMOS imaging technology enables superior image quality in many of today’s consumer and commercial applications, including mobile phones; security and surveillance; automotive; tablets, notebooks, webcams and entertainment devices; medical; and AR, VR, drones and robotics imaging systems. Find out more at www.ovt.com.

OmniVision®, CameraCubeChip™, OmniPixel®, and the OmniVision logo are trademarks or registered trademarks of OmniVision Technologies, Inc. All other trademarks are the property of their respective owners.

(1)Source: Sensor & Computing for ADAS vehicles report, Yole Développement, 2020.



Contact:

Media Contact:
Eric Lawson
Kiterocket
+1 480.276.9572
elawson@kiterocket.com

Company Contact:
Mengxi Liu
OmniVision Technologies, Inc.
+1 408.653.3484
mengxi.liu@ovt.com

Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise