Panel of electrical interface experts will showcase OIF’s latest work on multiple interfaces including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications
FREMONT, Calif. — (BUSINESS WIRE) — January 14, 2020 — OIF industry leaders will present and discuss OIF’s ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions on Wednesday, January 29 at 3:45 pm (local) at DesignCon in Santa Clara, CA.
OIF’s panel “Enabling New Architectures: An Update on OIF's CEI-112G Electrical Interfaces,” will provide an update on the five new interfaces, including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications, that will shape the future of next generation designs, ranging from die-to-die implementations all the way up to backplane and copper cable architectures.
Panel speakers include: Nathan Tracy of TE Connectivity and OIF President; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF Physical and Link Layer Interoperability Working Group Chair; Ed Frlan of Semtech and OIF Technical Committee Chair; Gary Nicholl of Cisco and OIF Board Member and Mike Li of Intel Corporation and OIF Board Member.
“Electrical interfaces at 112 Gbps are critical for faster, more efficient and cost-effective networks and data centers,” said Tracy. “This panel discussion will provide the opportunity for an engaging industry debate on the issues surrounding OIF’s CEI-112G projects and the architectures they will enable.”
OIF has led the industry for the past 20 years in the development and publication of next generation electrical definitions for transmitters, receivers and channels to enable interoperable electrical links for chip to chip, chip to optical, line card to line card and equipment to equipment applications. OIF is currently in the process of developing electrical link definitions for the next generation 112 Gbps data rate to provide signalling over a multitude of link types including die to die, chip to chip, chip to module, medium reach chip to chip and long reach chip to chip also known as backplane. OIF’s complete work on the CEI-112G can be found here.
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.
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