eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019

New software maps high-level AI workloads to eSilicon’s neuASIC modular AI ASIC IP platform

SAN JOSE, Calif., Aug. 15, 2019 (GLOBE NEWSWIRE) --

What
eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging solutions, will exhibit at Hot Chips 31.

eSilicon at Hot Chips 31
Introducing AI Accelerator Software
eSilicon’s 7nm FinFET neuASIC™ AI IP platform is a library of AI-specific tiles that can be configured to support an AI algorithm. eSilicon’s new AI Accelerator maps high-level AI workloads to the neuASIC platform and estimates PPA (power, performance, area) for the algorithm in the resultant silicon implementation.

neuASIC IP plus the AI Accelerator software allow design exploration of candidate architectures to ensure the design will be within the target specifications. This approach supports changes to the algorithm or the package.

eSilicon will be demonstrating AI Accelerator on Monday and Tuesday at its sponsor table.

AI Accelerator is available in IP Navigator, eSilicon’s IP exploration and evaluation tool, at no charge. A free eSilicon STAR account is required to access Navigator, which may be requested here.

Update on Chiplets
The idea of chiplets makes sense in terms of yield, cost and risk, but they haven’t really caught on. Is there a chiplet business model that works?

When & Where
Sunday-Tuesday, August 18-20, 2019
Memorial Auditorium, Stanford Campus
Palo Alto, California

Registration for the conference is still open online or on site during the event at the registration booth.

About e Silicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

eSilicon is a registered trademark, and neuASIC and the eSilicon logo are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners. 

Contacts:  
Sally SlemonsNanette Collins
eSilicon CorporationPublic Relations for eSilicon
Email Contact Email Contact


Primary Logo

Featured Video
Latest Blog Posts
Sanjay GangalGISCafe Guest
by Sanjay Gangal
GISCafe Industry Predictions for 2025 – NV5
Jobs
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center Las Vegas NV - Jan 7 - 10, 2025
GeoBuiz Summit 2025 at Hyatt Regency Aurora-Denver Conference Center. Denver CO - Jan 13 - 15, 2025
Coastal GeoTools 2025 Conference at 301 North Water Street - Jan 27 - 30, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise